tape automated bonding

Tire recent advance on applications of laser processing in VLSI is presented with the emphasis on metal planarization, tape automated bonding, multiple layer metal electrods, multichip interconnection and mask or chip failure repair.

包括激光金属平坦化，激光载带自动键合，激光多层布线和多芯片互连以及激光掩膜版和芯片图形缺陷的修复。

Bumped Tape Automated Bonding ( BTAB) Practical Application Guidelines

凸点载带自动焊接工艺（BTAB）实用指南

Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.

13.3节的内容既涉及热压连接工艺本身，也涉及了自动连接的传送带技术。

TAB ( tape Automated bonding) represents a new concept for IC assembly process. It can provide the advantage of small volume, low cost and high density.

TAB（载带自动焊）代表一种新的集成电路封装概念，它具有封装体积小、价格低、密度高等优点。

Tape Automated Bonding Technique

载带自动键合（TAB）引线技术